Three-dimensional multi-layer molded electronic device and method for manufacturing same
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United States of America Patent
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Jun 22, 1999
Grant Date -
N/A
app pub date -
May 3, 1996
filing date -
May 3, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A three-dimensional multi-layer molded electronic device and method for manufacturing same, wherein the device comprises at least two molded, three-dimensional substrates having mating surfaces, each substrate including a layer of patterned conductive material on at least one surface and electrically conductive vias at selected locations of the substrate for interconnection of the conductive layers, wherein the substrates are electrically joined at their mating surfaces and the circuit layers are aligned and interconnected to form a multi-layer, three-dimensional circuit which may include molded-in structural features.
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