Head suspension assembly with electrical interconnect by slider bond pads and gimbal bonding zones
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United States of America Patent
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Jun 22, 1999
Issued Date -
N/A
app pub date -
Jul 30, 1997
filing date -
Jun 17, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A head gimbal assembly allows a simplified, automatable electrical interconnection from the read/write head slider to the head suspension assembly electrical interconnect. The head suspension assembly is constructed as a laminated structure. Using a read/write head slider with electrical bond pads on an upper horizontal surface (i.e, the head slider surface bonded to the head suspension assembly and opposite to the disk-confronting head slider surface), electrical interconnection to bonding zones on the upper horizontal surface of the gimbal region is established using standard automated or semi-automated wire bond tooling technology.
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