Shock and vibration attenuating structure for an electronic assembly
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United States of America Patent
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Jun 22, 1999
Grant Date -
N/A
app pub date -
Dec 22, 1997
filing date -
Dec 22, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A shock and vibration attenuating structure and method is provided for an electronic assembly including a distribution circuit and at least one electronic component mounted on a surface of the distribution circuit. The shock and vibration attenuating structure includes a layer of elastomer material adapted to overlay the distribution circuit and substantially conform to the at least one electronic component. The layer includes a negative image of at least part of the at least one electronic component to allow the elastomer material to envelope the at least part of the at least one electronic component, and at least one relief formed in the elastomer material. The at least one relief is spaced from the negative image of the at least one electronic component and has a predetermined size, shape, and location in the elastomer material selected to protect the electronic component from shock and vibration induced loads and deflections with the layer overlaying the electronic assembly.
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