Saw for segmenting a semiconductor wafer
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United States of America Patent
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-
Jun 29, 1999
Issued Date -
N/A
app pub date -
Oct 30, 1997
filing date -
Mar 13, 1996
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An apparatus for cutting a semiconductor wafer comprises a wafer holding assembly and a cutting assembly having at least one cutting element. The apparatus further comprises a control assembly coupled to the cutting assembly which is operable to move the cutting assembly in first and second generally opposed directions relative to a wafer held by the wafer holding assembly. The cutting assembly is further operable to engage the wafer as the cutting assembly is moved in both the first and second directions. A method of segmenting a semiconductor wafer comprises the steps of providing a reciprocating cutting assembly, the cutting assembly including at least one cutting element and reciprocates in first and second generally opposed directions. The cutting assembly engages the wafer as the cutting assembly moves in the first direction and as the cutting assembly moves in the second direction.
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