Thin film forming method and apparatus
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United States of America Patent
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Jun 29, 1999
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app pub date -
Aug 23, 1995
filing date -
Aug 24, 1994
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Abstract
A thin film forming method for forming a thin film on a surface of a substrate having a stepped portion due to a difference in level, includes steps of performing first thin film deposition with plasma generated in a processing chamber by applying high-frequency voltages to electrodes, performing thin film shaping with plasma generated in the processing chamber by applying a high-frequency voltage to a coil, and performing second thin film deposition with plasma generated in the processing chamber by applying high-frequency voltages to the electrodes.
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