Multiple circuit board assembly having an interconnect mechanism that includes a flex connector
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United States of America Patent
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-
Jun 29, 1999
Grant Date -
N/A
app pub date -
Jun 16, 1997
filing date -
Jun 16, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multiple circuit board assembly comprising: a first circuit board having a first predetermined set of conductive traces on a surface; a second circuit board having a second predetermined set of conductive traces on a surface; an interconnect mechanism having a third set of traces that mate the first and second set of traces when sandwiched between the first circuit board and the second circuit board in a predetermined manner; and fastened to the first and second circuit boards together with the interconnect mechanism sandwiched between such that there is electrical contact between the first and second predetermined set of conductive traces. The interconnect mechanism can be either single sided flex connector cable, double sided flex connector cable, or Cinch connectors. The fastening mechanism can be snaps fittings or screw setups without or without resilient washers.
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