Method for assembling an integrated circuit chip package having at least one semiconductor device
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United States of America Patent
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Jul 6, 1999
Grant Date -
N/A
app pub date -
Oct 2, 1998
filing date -
Oct 14, 1997
priority date (Note) -
In Force
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Abstract
The present invention generally relates to the field of integrated circuit chip packaging. More particularly, the present invention relates to methods of manufacturing integrated circuit chip packages, and methods for electrically connecting and bonding or attaching semiconductor devices to an integrated circuit chip.
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