Apparatus for and method of processing substrate
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United States of America Patent
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Jul 6, 1999
Grant Date -
N/A
app pub date -
Feb 2, 1996
filing date -
Feb 13, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A plurality of transporter robots are provided on respective rails. Each semiconductor substrate is transported by a first robot from an indexer to processing units and then to a cooling plate. The second robot comes to the cooling plate and transports the substrate to other processing units. The cooling plate is used as an interface for the exchange of the substrate between the robots. No liquids nor gasses are applied to the substrate in the cooling plate and the substrate is passed to the next robot without contamination. No dedicated buffers are required, and thereby the size of the apparatus is reduced.
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