Multichip module assembly having via contacts and method of making the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 6, 1999
Grant Date -
N/A
app pub date -
Jan 24, 1997
filing date -
Jan 24, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A multichip module includes a printed circuit printed circuit board onto which traces of electrically conductive material are formed and into which groups of plated vias are formed. Each group of vias is associated with an integrated circuit to be mounted in the assembly and has a spacing pattern that is identical to the spacing pattern of the bond pads of the integrated circuit with which it is associated. A layer of insulative adhesive material is provided, one side of which is attached to the printed circuit board. A plurality of integrated circuits are attached to the other side of the adhesive material. Each of the integrated circuits has a plurality of bond pads in a spacing pattern. A conductive contact is disposed in each via to connect a bond pad to that via.
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