Method and apparatus for cooling integrated circuits using a thermoelectric module
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United States of America Patent
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Jul 13, 1999
Grant Date -
N/A
app pub date -
Apr 22, 1997
filing date -
Apr 22, 1997
priority date (Note) -
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Abstract
An integrated circuit cooling device in which a thermoelectric module (TEM) is built into a printed circuit board (PCB) so that the TEM converts heat generated by an integrated circuit on the PCB into DC power that is then supplied to a DC--DC regulator to drive a cooling fan. In one embodiment, the cooling fan is incorporated within a heat sink disposed on one side of the PCB so that the built-in TEM is between the heat sink and the integrated circuit being cooled. In an alternate embodiment, the cooling fan is located remotely from the heat sink.
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