Method for forming high tc superconductive thin films
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United States of America Patent
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Jul 13, 1999
Grant Date -
N/A
app pub date -
Nov 25, 1997
filing date -
Feb 6, 1997
priority date (Note) -
Expired
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Abstract
Herein disclosed is a superconductive thin film formation method of forming a superconductive thin film having a high critical temperature and a low surface resistance. The method comprises a first step of depositing a superconductive thin film layer on a substrate under a first condition. The superconductive thin film layer has a thickness smaller than that of the superconductive thin film. The method further comprises a second step of introducing oxygen under a second condition. The method further comprises a third step of depositing a superconductive thin film layer on the previously deposited superconductive thin film layer under the first condition and fourth step of introducing oxygen under the second condition. The method further comprises a fifth step of repeating the third and fourth steps until the sum of the thicknesses of the superconductive thin film layers is substantially equal to the predetermined thickness of the superconductive thin film.
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