Process for manufacturing a lead-on-chip semiconductor device package having a discontinuous adhesive layer formed from liquid adhesive
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United States of America Patent
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Jul 13, 1999
Grant Date -
N/A
app pub date -
May 9, 1997
filing date -
May 10, 1996
priority date (Note) -
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Abstract
A lead-on-chip semiconductor device package is formed by attaching a lead frame to the chip with a discontinuous adhesive layer. Electrode pads of the chip are electrically connected by bonding wires and mechanically connected by the adhesive layer to the lead frame, and then encapsulated by an encapsulant such as molding compound. The adhesive layer is formed from a liquid adhesive material having a certain viscosity. Although the liquid adhesive is continuously applied to top surfaces of the inner leads as well as gaps between adjacent inner leads, the adhesive layer is formed only on the top surfaces of the inner leads while the liquid adhesive falls through the gaps. Thermoplastic or thermosetting resins may be used as the liquid adhesive.
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