Methods and apparatuses for singulation of microelectromechanical systems
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United States of America Patent
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Jul 13, 1999
Grant Date -
N/A
app pub date -
Apr 18, 1997
filing date -
Apr 18, 1997
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Disclosed are methods and apparatuses that allow the dicing of wafers containing microelectromechanical systems into singulated individual dies that is economic to use and leaves substantially no residue on the surface of the individual dies. A method for packaging the dice singulated according to the present invention is also disclosed.
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