IC contacts with palladium layer and flexible conductive epoxy bumps
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United States of America Patent
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Jul 20, 1999
Grant Date -
N/A
app pub date -
May 21, 1996
filing date -
May 21, 1996
priority date (Note) -
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Abstract
An apparatus and method for forming a substrate having a palladium metal layer over at least one contact point of the substrate and having a flexible conductive polymer bump, preferably a two-stage epoxy, on the palladium plated contact point. The present invention also relates to assemblies comprising one or more of these substrates.
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