Ultra fine probe contacts

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5926029
SERIAL NO

08863268

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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This discloses a probe structure which does not rely on cantilevered wire and which has improved and controlled contact pressure between the probe tip contacts and the I/O pads on a semiconductor chip and which comprises a plurality of conductive contact electrodes, electrically coupled to respective leads, formed on a film stretched across a respective plurality of through holes established in a substrate. The through holes and the contact electrodes are aligned with one another and both positionally match selected I/O pads existing on a semiconductor chip to be probed. Also disclosed is a probe utilizing means connected to each one of the holes to control the pressure in the holes and between the probes and any contact on a device in contact with the probe.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ference, Thomas G Essex Junction, VT 33 879
Howell, Wayne J Williston, VT 40 2297

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