Method and apparatus for the thermal management of electronic devices
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United States of America Patent
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-
Jul 20, 1999
Grant Date -
N/A
app pub date -
Dec 9, 1997
filing date -
Dec 9, 1997
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An apparatus comprising an enclosure, a power supply circuit and a passive heat removal device is described. Specifically, the enclosure having a plurality of sides defines an air plenum wherein select ones of the plurality of sides have openings disposed therein with a fan disposed within a first of the openings. The power supply circuit, disposed within the enclosure, is operative to provide power to electronic components disposed outside of the enclosure, and to dissipate heat into the air plenum. The passive heat removal device, disposed along a first of said plurality of sides, is operative to transfer heat generated by one or more electronic devices thermally coupled to the outside of the enclosure into the air plenum for evacuation by the fan.
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