Vertically integrated multi-chip circuit package with heat-sink support
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United States of America Patent
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-
Jul 20, 1999
Grant Date -
N/A
app pub date -
Jan 22, 1998
filing date -
Jan 22, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multi-chip carrier which uses less lateral mounting space on the surface of a circuit board or card can be formed using flexible circuitized material. Lateral space is compressed by utilizing more vertical space to package chips and components. The problem of cooling multiple chips in a tight space may be accomplished by integrating the heat sink in with the circuit carrier and having the heat sink double as a support structure. A flex material is folded or shaped. Different regions of the flex are used for mounting chips, mounting support mechanisms, or mounting the structure on a carrier or substrate.
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