Multilayer printed board
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United States of America Patent
Stats
-
Jul 20, 1999
Grant Date -
N/A
app pub date -
Nov 17, 1997
filing date -
Mar 31, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A multilayer printed board has at least a signal layer, a power source layer, and a ground layer that are formed one upon another with insulation material being interposed among the layers. The board is capable of reducing radio waves to be emitted from the board. The board is provided with capacitors that are continuously or discretely formed at the edges of an overlapping pattern of the power source layer and ground layer, to pass a high-frequency current from the power source layer to the ground layer, thereby reducing the emission of radio waves.
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Cited Art Landscape
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