Method of stacking electronic components
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United States of America Patent
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Jul 27, 1999
Issued Date -
N/A
app pub date -
Oct 21, 1996
filing date -
Nov 16, 1993
priority date (Note) -
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Abstract
A method of stacking electronic components is disclosed. A first electronic component having a first interconnection substrate with a first set of contact pads on at least one surface thereof is provided. At least a first semiconductor device with resilient contact structures mounted thereto is provided. The first semiconductor device is positioned relative to the first electronic component with the resilient contact structures extending therefrom and electrically contacting the first set of contact pads of the first interconnection substrate.
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