Processing system hot plate construction substrate
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United States of America Patent
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-
Jul 27, 1999
Grant Date -
N/A
app pub date -
Apr 17, 1997
filing date -
Apr 23, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a substrate thermal processing device, a temperature of a substrate can be precisely controlled within a short time by means of a hot plate oven. The substrate thermal processing device includes a substrate supporting plate for supporting the substrate, an auxiliary heating/cooling section for heating or cooling the substrate and having a Peltier effect element and disposed on a lower surface of the substrate supporting plate, and a main heating section for heating the substrate and disposed below the substrate supporting plate and the auxiliary heating/cooling section.
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