Microneedle with isotropically etched tip, and method of fabricating such a device

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United States of America Patent

PATENT NO 5928207
SERIAL NO

08884867

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A microneedle includes an elongated body with a top surface, a bottom surface, a first side wall between the top surface and the bottom surface, and a second side wall between the top surface and the bottom surface. An end is defined by the bottom surface converging into a tip, an isotropically etched portion of the first side wall converging into the tip, and an isotropically etched portion of the second side wall converging into the tip. The elongated body is less than approximately 700 .mu.m wide and less than approximately 200 .mu.m thick. The elongated body may incorporate a fluid channel. The elongated body may be formed of silicon that is not doped with Boron. In such a configuration, integrated circuitry or a micromachined device, such as a heater or pump may also be formed on the device. A number of novel processing techniques are associated with the fabrication of the device. The device may be formed by relying solely on isotropic etching. Alternately, a combination of isotropic and anisotropic etching may be used. Unlike prior art micromachined devices, the disclosed device may be processed at relatively low temperatures below 1100.degree. C. and without using the carcinogen ethylenediamin pyrocatechol.

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Patent Owner(s)

Patent OwnerAddress
REGENTS OF THE UNIVERSITY OF CALIFORNIA THE300 LAKESIDE DRIVE 22ND FLOOR OAKLAND CA 94612 UNITED STATES OF AMERICA

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lebouitz, Kyle S Albany, CA 17 2860
Pisano, Albert P Livermore, CA 41 3197

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