Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
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United States of America Patent
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Jul 27, 1999
Grant Date -
N/A
app pub date -
Oct 21, 1996
filing date -
Oct 21, 1996
priority date (Note) -
Expired
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Abstract
Apparatus and concomitant method for performing priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing system (cluster tool). The sequencer assigns priority values to the chambers in a cluster tool, then moves wafers from chamber to chamber in accordance with the assigned priorities. The sequencer is capable of determining the amount of time available before a priority move is to be performed and, if time is sufficient, the sequencer performs a non-priority move while waiting. The sequencer also dynamically varies assigned priorities depending upon the availability of chambers in the tool. Lastly, the sequencer prioritizes the chambers based upon the minimum time required for the robot to move the wafers in a particular stage.
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