Compliant integrated circuit package and method of fabricating the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 27, 1999
Grant Date -
N/A
app pub date -
Dec 29, 1994
filing date -
Dec 29, 1994
priority date (Note) -
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status (Latency Note)
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Abstract
Semiconductor chip packages and methods of fabricating the same. The package includes a thermally conductive protective structure having an indentation open to a front side and a flange surface at least partially surrounding the indentation and facing to the front of the structure. A chip is disposed in the indentation so that the front surface of the chip, with contacts thereon, faces toward the front of the structure. A flexible dielectric film having terminals thereon is placed on the flange surface, and a compliant material is disposed between the film and the flange surface. The terminals on the film are connected to the contacts on the chip. The individual terminals on the film are movable with respect to the protective structure, which facilitates mounting and compensation for thermal expansion.
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