Projected contact structure for bumped semiconductor device and resulting articles and assemblies
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United States of America Patent
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Jul 27, 1999
Grant Date -
N/A
app pub date -
Mar 26, 1997
filing date -
Mar 26, 1997
priority date (Note) -
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Abstract
A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a bumped die and a bumped packaged IC device. The projections are arranged to make electrical contact with the solder balls of a bumped IC device without substantially deforming the solder ball. Accordingly, reflow of solder balls to reform the solder balls is not necessary with the contact pad of the present invention. Such a contact pad may be provided on various testing equipment such as probes and the like and may be used for both temporary and permanent connections. Also disclosed is an improved method of forming the contact pads by etching and deposition.
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