Standoff controlled interconnection
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 3, 1999
Grant Date -
N/A
app pub date -
Jan 16, 1997
filing date -
Jan 16, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for joining a component to a substrate applies a base solder portion to the substrate and provides a standoff solder portion in the base solder portion. The standoff solder portion has a higher melting temperature than the base solder portion and a height which substantially corresponds to a desired standoff height between the component and the substrate. The component is positioned on the standoff solder portion and the base solder portion is melted under reflow conditions to form a solder joint between the component and the substrate. This joint substantially encapsulates the standoff solder portion, wherein the reflow conditions create a dendritic structure between the base solder portion and the standoff solder portion.
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