Heated pressure transducer assembly
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United States of America Patent
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Aug 3, 1999
Issued Date -
N/A
app pub date -
May 27, 1997
filing date -
Jan 16, 1996
priority date (Note) -
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status (Latency Note)
Importance
Abstract
The disclosed pressure transducer assembly includes an external enclosure, a thermal shell disposed within the external enclosure, and a pressure sensor disposed within the thermal shell. The pressure sensor senses the gas or vapor pressure present in a tube coupling the sensor to a source of pressurized gas or vapor. The assembly includes a device for heating the thermal shell, and thermal insulation is disposed between the thermal shell and the external enclosure. The thermal insulation includes a plurality of metalized high temperature films stacked one on top of another and a plurality of spacer layers, each of the spacer layers being disposed between adjacent ones of the metalized high temperature films.
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