Photo-curable resin composition and process for preparing resin-basedmold
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United States of America Patent
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Aug 3, 1999
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app pub date -
May 30, 1997
filing date -
May 30, 1997
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Abstract
A photo-curable resin composition suitable as a material for photo-fabricating and capable of producing cured products with excellent mechanical strength and high heat resistance. Further disclosed is a process for molding a resin-based mold which provides superior molding dimensional precision and superb repetition durability. The resin composition contains a monomer component containing (A) 30-70 wt % of a polyfunctional unsaturated monomer having a cyclic structure and (B) 70-30 wt % of a monofunctional unsaturated monomer having a cyclic structure of which the homopolymer has a glass transition temperature (Tg) of 70.degree. C. or higher; (C) a photo-initiator; and (D) an inorganic filler having an average particle diameter or an average fiber length of 1-50 .mu.m, wherein the ratio of the inorganic filler to 100 parts by volume of the monomer components and the photo-initiator is 100-160 parts by volume, and the heat distortion temperature of the cured resin produced from the photo-curable resin composition is 100.degree. C. or higher.
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