Thermal print module and method of using same
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United States of America Patent
Stats
-
Aug 3, 1999
Grant Date -
N/A
app pub date -
Aug 5, 1997
filing date -
Aug 5, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A thermal print module and method includes a two-part snap-together housing and encloses a heated print element. An insulated spring finger is integrally formed on one housing part to move the heated print element for receiving a thermal-sensitive ink carrier for loading it into its printing position within the unit, wherein the spring finger protects the user from inadvertently touching the heated element. A two-position lever is used alternatively to move the heated print element for carrier loading purposes. A sensor is activated by the lever to de-activate electrically the print module during carrier loading operations.
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