Importance

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Abstract

Apparatus and method for metal line deposition on a substrate. Laser ablation of a metal film coated on a first substrate removes metal ions from the film. The ions travel forward to a surface of a second substrate disposed opposite the metal film on the first substrate and are deposited on the second substrate. A positive electrode on the first substrate, a negative electrode on the second substrate, and a power supply create an electric field that is simultaneously applied across the first and second substrates to bond the metal ions to the second substrate. Bonding is enhanced by repeated reflecting a laser beam through the second substrate to heat the second substrate. The laser beam is reflected between a reflector and the deposited metal line. Also provided is a method and apparatus for repairing or augmenting metal lines on a first substrate by disposing a second substrate having a metal coating on its surface in spaced relation to the first substrate such that the metal line on the first substrate is adjacent the surface of the second substrate having the metal coating. The metal coating is ablated to discharge ions of the metal coating. An electric field is applied across the second substrate and the metal line to drive the ions to the metal line and to electrostatically bond the metal ions to the metal line.

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First Claim