Method of passivating a micromechanical device within a hermetic package
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United States of America Patent
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Aug 10, 1999
Grant Date -
N/A
app pub date -
May 11, 1998
filing date -
Apr 12, 1996
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method of passivating a hermetically sealed micromechanical device (14) with a passivant (100). A predetermined quantity of the passivant (100) is placed within the cavity (54) of a lid (42) after the lid and package base (46) have been activated. Thereafter, by heating the package (10) including the passivant, the passivant will sublime within the hermetically sealed package (10) to provide a monolayer of passivant across the active surfaces of the micromechanical die (14). An improved hermetic seal is achieved since the passivant is sublimed after the laser weld process. In addition, the effectiveness of the passivation process is improved since the passivation is performed after the package is sealed, without the risk of any impurities entering into the package to degrade the effectiveness of the passivation.
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