Stabilized porous, electrically conductive substrates
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United States of America Patent
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Aug 17, 1999
Grant Date -
N/A
app pub date -
Aug 29, 1996
filing date -
Aug 29, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is an apparatus which comprises at least one semiconductor chip mounted on a substrate, said substrate comprising a porous, electrically conductive member having electrophoretically deposited thereon a coating of a polymeric material. In one embodiment, the semiconductor chips are thermal ink jet printhead subunits.
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