Thermal performance package for integrated circuit chip
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United States of America Patent
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Aug 17, 1999
Issued Date -
N/A
app pub date -
Nov 24, 1992
filing date -
May 31, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Composite materials for electronic packages are disclosed. The composite materials comprise a core layer and first and second cladding layers. The core and cladding layer compositions and thicknesses are selected to maximize thermal and electrical conductivity and to minimize the coefficient of thermal expansion of the composite. The composite material may be employed to fashion the package base, the leadframe, a heat spreader or combinations thereof. In one embodiment, a portion of the first cladding layer is removed so that an electronic device may be mounted directly to a high thermal conductivity core.
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