Wire mesh insert for thermal adhesives
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United States of America Patent
Stats
-
Aug 17, 1999
Grant Date -
N/A
app pub date -
Jun 6, 1997
filing date -
Jun 6, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Volume and thickness of the bond are controlled by the inclusion of a wire mesh embedded in a preform or through which the thermoplastic adhesive is pressed during bonding. The wire mesh also increases heat transfer through the adhesive in a regulated and even manner over the area of the bond or any desired portion thereof. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.
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Cited Art Landscape
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