Method and apparatus for testing dies
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United States of America Patent
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Aug 24, 1999
Grant Date -
N/A
app pub date -
May 7, 1997
filing date -
May 7, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
In accordance with the present invention, a test board for connecting a bare die to a leadframe for testing the die is provided. The test board has a conducting surface on a bottom portion of the board that is adapted to engage and electrically connect to a lead finger in the leadframe. A tape automated bonding tape which has a conductive lead and a first and a second conductive bump are provided where the first conductive bump is situated on an upper surface of the lead and the second conductive bump is situated on a bottom surface of the lead. The first and second conductive bumps establish an electrical communication between the bumps throughout the conductive lead. The first conductive bump is also connected to the conducting surface of the board and the second bump is adapted to engage in I/O pad so that the bare die may be tested through the leadframe.
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