Apparatus for testing a nonpackaged die
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United States of America Patent
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-
Aug 24, 1999
Issued Date -
N/A
app pub date -
Aug 12, 1997
filing date -
May 12, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A fixture is provided for making temporary electrical connections with an integrated circuit die having interconnect pads arranged in a predetermined pattern. The fixture includes contact elements carried by a substantially rigid support member in a pattern corresponding to the predetermined pattern of interconnect pads and adapted to engage a single die. An engagement assembly is provided for bringing the interconnect pads and the contact elements together to make nonpermanent temporary simultaneous electrical connections therebetween. The engagement assembly includes a package having leads in a configuration compatible with test, burn-in and handling equipment for conventional integrated circuit packages.
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