Importance

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Abstract

The invention discloses a three-dimensional module with the use of volume unpackaged and film electronic components. Between the independent electronic components comprising IC chips and the microboards comprising active and passive electronic components are disposed intermediate multifunctional boards. All module members are fabricated mostly from heat conductive materials, and together with the module's heatsinks make up an effective heat dissipation system. The microboards and intermediate boards further contain film active and passive components fabricated using semiconductor, thin film and thick film techniques and increasing the operational range of equipment. The proposed design is versatile and can be used in any-purpose electronic equipment. The module structure allows its application under severe operational conditions and increases the packing density up to the technological limit. Disclosed are cost-saving techniques of module assembly by means of capillary soldering or with the help of elastic elements.

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First Claim