Cooling apparatus, cooling method, and processing apparatus
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United States of America Patent
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-
Aug 31, 1999
Grant Date -
N/A
app pub date -
Feb 13, 1998
filing date -
Feb 14, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A refrigerant is directly contacted to a substrate to be processed that was heated so as to quickly cool the substrate. Thus, the temperature of the substrate is dropped to a predetermined temperature level. The substrate is cooled by a cooling device and cooling water. Thus, the cooling temperature can be accurately controlled. In addition, the substrate can be effectively cooled.
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