Heat-activated wire terminal assembly and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 31, 1999
Grant Date -
N/A
app pub date -
Oct 31, 1997
filing date -
Oct 31, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wire terminal assembly includes a wire terminal having a cylindrical heat-shrinkable sleeve extending over one end for receiving solder interposed between the terminal and the heat-shrinkable sleeve. The heat-shrinkable sleeve receives an end of a conductor such that heat can be applied to the junction of the terminal, conductor and sleeve to bond the conductor to the terminal and shrink the sleeve over the junction of the conductor and terminal. This invention also contemplates the process of attaching a wire to a terminal by inserting a heat-shrinkable sleeve over a terminal, inserting solder into the sleeve from an end opposite the terminal to surround the terminal, inserting an end of a conductor into the open end of the sleeve and heating the terminal, solder and sleeve to a temperature which melts the solder and shrinks the sleeve onto the junction of the conductor and terminal.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully