Process for manufacturing mold inserts
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United States of America Patent
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-
Aug 31, 1999
Issued Date -
N/A
app pub date -
Dec 19, 1997
filing date -
Jul 1, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a method of manufacturing mold inserts by galvanic metal deposition a substrate consisting of an electrically conductive material which cannot be structured lithographically is structured by mechanical precision machining to provide different levels on the substrate which is then covered by an electrically insulating material which can be structured lithographically and which is fine structured by depth lithography to form cavities therein which are then filled by galvanic deposition of a metal layer. The metal structure so formed is then separated from the substrate and the electrically non-conductive material to provide the mold insert with projections of different heights.
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