Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package
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United States of America Patent
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Aug 31, 1999
Grant Date -
N/A
app pub date -
Mar 12, 1997
filing date -
Mar 12, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An integrated circuit package for improved warp resistance and heat dissipation is described. The LOC package includes: an integrated circuit die having an upper, active face, and a multi-layered, substantially planar lead frame mounted to the active face of the die, where the lead frame is preferably comprised of layers configured as Cu/INVAR/Cu or Cu/Alloy 42/Cu. The choice of the middle layer of the lead frame is selected to minimize the warping forces on the package such that the coefficient of thermal expansion of the composite lead frame approximates that of silicon. The copper layers of the lead frame provide improved heat dissipation.
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