Semiconductor chip housing having a reinforcing plate
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United States of America Patent
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Aug 31, 1999
Issued Date -
N/A
app pub date -
Mar 5, 1997
filing date -
Nov 21, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device employs interconnecting films on film circuit as ground lines which extend to the periphery of the film circuit where there is a further connection to a conductive reinforcing plate. Advantageously the conductive reinforcing plate reduces electrical noise from interfering with the semiconductor device and prevents the semiconductor device from radiating undesired signals. The interconnecting films also reduce cross-talk between signal lines of the semiconductor device.
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