Heat pipe arrangement for enhancing the cooling capacity of a laptop computer
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United States of America Patent
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Aug 31, 1999
Grant Date -
N/A
app pub date -
Sep 23, 1997
filing date -
Sep 23, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An arrangement for enhancing the cooling capacity of portable personal computers. The power dissipation of portable personal computers (PCS) is enhanced by transferring heat through a flexible heat pipe which is arranged in operative relationship with a novel hinge structure incorporating link elements pivotably interconnecting a display panel with a bottom processor housing so as to impart minimal bending stresses to the flexible heat pipe responsive to pivoting of the display panel, and which facilitates transferring the heat into an area at the rear of the display panel.
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