High density connector arrangement for a circuit board module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 7, 1999
Grant Date -
N/A
app pub date -
Jan 13, 1997
filing date -
Jan 13, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A circuit board module includes a plurality of high density edge connectors in which the contacts are arranged in rows, with contact tails extending from the connectors for electrical connection to a circuit board carrying electrical components. Instead of terminating the contacts directly to pads or terminals on the principal surface of the circuit board on which the electrical components are situated, however, the contact tails are terminated to pads or terminals on pairs of intermediate circuit boards connected to the main boards, the intermediate circuit boards each providing two termination surfaces rather than one, thereby effectively doubling the space available for termination. The intermediate circuit boards are connected to the main circuit board by a rigid-flex interconnection, thus facilitating assembly of the connectors to a heatsink or frame of the circuit board following termination of the contact tails to the intermediate circuit boards.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully