Importance

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Abstract

A transcutaneous transmission patch transfers power and/or data to an implantable device implanted under a user's skin. The transcutaneous transmission patch is made of a flexible material with a top surface and a bottom surface. Located on or formed within the top surface is a pouch or cavity that houses electronic circuitry. The electronic circuitry typically includes a substrate on which an integrated circuit (IC) chip and a transmission coil are mounted. Alternatively, the transmission coil may be molded within the flexible material from which the pouch is made. The electronic circuitry is capable of transcutaneously transmitting power and/or data to a receiving coil in the implanted device. The electronic circuitry is powered by a battery or other power source which is also housed within the pouch or cavity or otherwise carried by the patch. The bottom surface of the transcutaneous transmission patch includes an adhesive layer that detachably secures the patch to a skin surface of the user. In one embodiment, the transcutaneous transmission patch is disposable. In another embodiment, select components of the transcutaneous transmission patch may be removed and reused.

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First Claim