Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip
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United States of America Patent
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Sep 7, 1999
Grant Date -
N/A
app pub date -
Nov 26, 1997
filing date -
Dec 9, 1996
priority date (Note) -
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Abstract
An IC chip for signal processing circuit is enclosed in a mold IC and a pressure sensitive element unit is integrally provided thereon. When the mold IC is housed in a case, the mold IC is fixed to the case under a state where ends of connector pins insert-molded to the case are electrically connected to external terminals of the mold IC. Thereby, a sensor signal is outputted from other ends of the connector pins. By integrating the IC chip for signal processing circuit in the mold IC, the IC chip for signal processing circuit can be protected against a contaminated environment at a location where the pressure sensitive element unit is arranged.
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