Bonding head
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United States of America Patent
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-
Sep 14, 1999
Grant Date -
N/A
app pub date -
Mar 25, 1997
filing date -
Mar 13, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A bonding head is provided for a wire bonding machine which includes a wedge (2) connected to a transducer (3) for applying pressure and ultrasonic energy to a wire (1) guided into contact with a substrate to which a bond is to be formed. A support system (7, 8, 9) is provided for simultaneously securing the transducer (3) to the bonding head frame (12) and variably adjusting the contacting pressure of the wire to the substrate. Springs (9a, 9b), preferably leaf springs, urge the transducer (3), while a linear actuator (8) is arranged to variably tension the springs (9a, 9b) to adjust the bond force.
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Cited Art Landscape
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