Aluminum alloys for electronic components
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United States of America Patent
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Sep 14, 1999
Grant Date -
N/A
app pub date -
Oct 21, 1997
filing date -
Oct 21, 1997
priority date (Note) -
Expired
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Importance
Abstract
Anodizable components for electronic packaging applications, such as substrates for printed circuit boards or ball grid array electronic packages, having conductive circuitry formed on an electrically non-conductive anodic film. To inhibit the formation of electrically conductive precipitates in the anodic film that can form an electrical short circuit between the circuit traces and the metallic core of the component, the metallic core is formed from an anodizable alloy having below thresholds of precipitate forming constituents. Such precipitate forming constituents include iron, silicon and manganese.
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