Metal ball grid electronic package having improved solder joint
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United States of America Patent
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-
Sep 14, 1999
Issued Date -
N/A
app pub date -
Jul 10, 1997
filing date -
Jul 14, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The bending of a ball grid array electronic package having a metallic base is reduced minimizing stresses applied to the innermost row of solder balls when the package base is cyclically heated and cooled. Reducing the stresses applied to the solder balls increases the number of thermal cycles before solder ball fracture causes device failure. Among the means disclosed to reduce the bending moment are a bimetallic composite base, an integral stiffener, a centrally disposed cover bonded to an external structure and a package base with a stress accommodating depressed portion.
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