Importance

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Abstract

A wafer probe system includes a plurality of vertical-parallel probe pins having a spring formed in a center portion thereof to provide a contact force control area. The spring being formed according to a predetermined shape having a known stress-strain profile. In one embodiment, a first spring shape results in a probe tip contact force that is approximately constant after an initial vertical displacement of the probe tip. In an alternate embodiment, a second spring shape formed in the probe pin results in decreasing probe tip contact force with increasing vertical displacement of the probe tip. A canted probe tip end permits creation of an X-Y force component to facilitate penetration of the passivation layer. The canted tip portion also permits non-rotatable alignment of the probe pins in a probe card to thereby prevent contact of one probe pin with another. Impedance controlled test signal transmission lines permit enhanced high frequency testing of device under test circuits, and lower signal power requirements.

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First Claim