US Patent No: 5,953,590

Number of patents in Portfolio can not be more than 2000

Method and apparatus to hold integrated circuit chips onto a chuck and to simultaneously remove multiple integrated circuit chips from a cutting chuck

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ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

A cutting chuck for use with a cutting blade and for holding a semiconductor wafer in place during a dicing process and a die pick for picking the segmented semiconductor wafer from the chuck. The chuck includes a surface for supporting the wafer and several ports in the surface connected to a vacuum source. Preferably, the cutting chuck includes a housing having a base and a wall. A vacuum chamber is provided within the housing and on top of the base. A porous layer is located in housing and above the vacuum chamber. A surface layer is above the porous layer and contains ports connecting the surface supporting the wafer to the vacuum chamber via the porous layer. In a most preferred embodiment, the chuck is removeably attached to the vacuum source via a check valve. The cutting chuck may also include recesses in the surface to prevent impingement on the cutting chuck by a cutting blade during wafer dicing. The die pick includes a pick head having a surface for contacting the plurality of die sawn from a wafer. The surface includes a plurality of ports that are in fluid communication with a vacuum source. The die pick picks the plurality of die from the chuck for further processing.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID18599

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Keith, Chris Caldwell, ID 3 37
Piper, John G Midvale, ID 7 96

Cited Art

Patent Info (Count) # Cites Year
 
TEXAS INSTRUMENTS INCORPORATED (4)
5,445,559 Wafer-like processing after sawing DMDs 67 1993
5,527,744 Wafer method for breaking a semiconductor 51 1994
5,605,489 Method of protecting micromechanical devices during wafer separation 64 1995
5,618,759 Methods of and apparatus for immobilizing semiconductor wafers during sawing thereof 23 1995
 
DISCO CO., LTD. (2)
4,521,995 Wafer attracting and fixing device 54 1981
4,625,463 Wafer attracting and fixing device 28 1985
 
CITIZEN WATCH CO., LTD. (1)
4,597,228 Vacuum suction device 39 1984
 
DESIGN TECHNOLOGIES LIMITED (1)
4,808,046 Cutting method 22 1987
 
EASTMAN KODAK COMPANY (1)
5,029,418 Sawing method for substrate cutting operations 37 1990
 
ROHM CO., LTD. (1)
5,451,549 Semiconductor dicing method which uses variable sawing speeds 15 1994

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (11)
7,713,841 Methods for thinning semiconductor substrates that employ support structures formed on the substrates 1 2003
7,244,665 Wafer edge ring structures and methods of formation 2 2004
7,547,978 Underfill and encapsulation of semiconductor assemblies with materials having differing properties 2 2004
7,960,829 Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates 0 2005
7,521,296 Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material 0 2006
7,488,618 Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same 3 2006
7,442,643 Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials 1 2006
7,615,119 Apparatus for spin coating semiconductor substrates 0 2006
7,489,020 Semiconductor wafer assemblies 0 2006
7,282,806 Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material 1 2006
7,923,298 Imager die package and methods of packaging an imager die on a temporary carrier 1 2007
 
ROKKO SYSTEMS PTE LTD. (3)
7,540,503 Vacuum holder for integrated circuit units 0 2005
7,829,383 Supply mechanism for the chuck of an integrated circuit dicing device 1 2005
7,939,374 Supply mechanism for the chuck of an integrated circuit dicing device 0 2010
 
TEXAS INSTRUMENTS INCORPORATED (3)
7,378,293 MEMS fabrication method 2 2006
8,257,985 MEMS device and fabrication method 0 2008
7,943,489 Bonded wafer assembly system and method 1 2008
 
SYMBOL TECHNOLOGIES, INC. (2)
7,023,347 Method and system for forming a die frame and for transferring dies therewith 40 2003
7,795,076 Method, system, and apparatus for transfer of dies using a die plate having die cavities 0 2004
 
AMKOR TECHNOLOGY, INC. (1)
6,423,576 Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package 7 1999
 
DISCO CORPORATION (1)
7,649,157 Chuck table for use in a laser beam processing machine 1 2005
 
FREESCALE SEMICONDUCTOR, INC. (1)
6,150,240 Method and apparatus for singulating semiconductor devices 21 1998
 
SAMSUNG ELECTRONICS CO., LTD. (1)
6,121,118 Chip separation device and method 49 1999
 
SCHOTT AG (1)
8,193,073 Method for separating parts from a substrate 0 2006